Semiconductor Engineering:
Q&A with Ann Kelleher, SVP & GM of Technology Development at Intel on the company's new logic roadmap, lithography, packaging, and process technology — Five process nodes in four years, high-NA EUV, 3D-ICs, chiplets, hybrid bonding, and more. — Ann Kelleher, senior vice president …
from Techmeme https://ift.tt/3DrD4BN
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